Arduino Controlled Investigation and Thermal Simulation of One-Dimensional Stable Heat Transfer in Multilayer Plane Wall

Abstract

There are innumerable events related to heat transfer that we experience or see in our daily lives. In this study, research and experimental calculations were made about multilayer plane walls, which are often made of different materials. There are so much application areas on heat transfer. In order to better understand heat conduction, we need to make an explanation of the thermal properties and heat transfer type of the materials used in the experiment. It is known that heat transfer occurs in three different ways (conduction, convection, radiation). In this study, a layered wall heat conduction mechanism was established by combining 6 different materials (Copper, St37 Steel, AISI 1050 Aluminum, Wood, Rock wool, Glass wool) with different pediments of 30*30 cm. Heat is produced by gradually applying voltage from the copper plate and the temperature between each plate is measured by temperature sensors with Arduino programming. In the Arduino assembly, one Arduino Unocard, 5 lm35 temperature sensors and 1 20*4 I2C LCD screen are used to take the measurement outputs. The LM35 temperature sensor produces a voltage between zero and 5 V from the analog output, and the temperature measurement is made by producing a value of 10mV for each degree Celsius. The right leg of lm35s with three legs is connected to GND on the breadboard for grounding, the middle leg is connected to the analog output on the uno board, the left leg is connected to the 5V input on the breadboard and 5 lm35s are connected in parallel on the breadboard. The sensors were placed in the middle of the plates and the measurements were printed and recorded on the LCD screen. The measurements in the experimental setup were analyzed by applying a stepped voltage of the same value to the layered wall designed from the same materials in the SolidWorks thermal program, the data were collected and compared with the theoretical calculations of heat transfer.