Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
- 1 May 2022
- journal article
- research article
- Published by Elsevier BV in Applied Surface Science
Abstract
No abstract availableFunding Information
- Department of Science and Technology, Ministry of Science and Technology, India (DST/TDT/AMT/2017/181(G))
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