Hybrid SERS analysis of reactive nanoparticles for chemical interaction in copper CMP
- 19 December 2016
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE) in 2016 International Symposium on Flexible Automation (ISFA)
Abstract
Currently, Cu-CMP is widely used as a key process technology for planarization of wiring layers in the copper dual-damascene process. To achieve planar surfaces for higher pattern densities the novel Cu-CMP technique that uses a slurry containing reactive nanoparticles such as fullerenol and ND-PG as abrasive grains has been developed. In this study, the in situ surface analysis method using the novel hybrid SERS is proposed to reveal the copper-reactive nanoparticle interaction during Cu-CMP. The hybrid SERS analysis method enables simultaneous measurement of Raman spectra enhanced by both propagating and localized surface plasmon. Using this method, the molecular-level interaction between the copper surface and reactive nanoparticles is investigated in a real time chemical process. Measuring a series of SERS Raman spectra changing with surface roughness, the role of C60(OH)36 in forming of a reacted thin film on the copper surface was suggested using a custom-built measurement system.Keywords
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