Low Temperature Sintered Silver Nanoflake Paste for Power Device Packaging and Its Anisotropic Sintering Mechanism
- 16 November 2021
- journal article
- research article
- Published by American Chemical Society (ACS) in ACS Applied Electronic Materials
- Vol. 3 (12), 5365-5373
- https://doi.org/10.1021/acsaelm.1c00857
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (21805189)
- Natural Science Foundation of Guangdong Province (2018A030310617, 2021A1515012284)
- Shenzhen basic research plan (JCYJ20190807154409372)
- SIAT Innovation Program for Excellent Young Researchers (E1G014)
This publication has 24 references indexed in Scilit:
- Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic PackagingMATERIALS TRANSACTIONS, 2016
- Effect of surface carbon coating on sintering of silver nanoparticles: in situ TEM observationsChemical Communications, 2014
- Resistivity transition mechanism of silver salts in the next generation conductive ink for a roll-to-roll printed film with a silver networkJournal of Materials Chemistry, 2012
- Low-temperature low-pressure die attach with hybrid silver particle pasteMicroelectronics Reliability, 2012
- Preparation of Conductive Silver Films at Mild Temperatures for Printable Organic ElectronicsChemistry of Materials, 2011
- Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing LigandsChemistry of Materials, 2010
- Triggering the Sintering of Silver Nanoparticles at Room TemperatureACS Nano, 2010
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached InterconnectionJournal of Electronic Materials, 2007
- Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsJournal of Electronic Materials, 2005
- Evidence for the Monolayer Assembly of Poly(vinylpyrrolidone) on the Surfaces of Silver NanowiresThe Journal of Physical Chemistry B, 2004